Univerzita Pardubice Fakulta chemicko- technologická

Univerzita Pardubice

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Publikace detail

AM printing of desoldering paste for the disassembling of electronic components from PCBs

Autoři: Syrový Tomáš | Syrová Lucie

Rok: 2024

Druh publikace: ostatní - přednáška nebo poster

Strana od-do: nestránkováno

Tituly:

Jazyk	Název	Abstrakt	Klíčová slova
eng	AM printing of desoldering paste for the disassembling of electronic components from PCBs	The presented study focusses on the development of desoldering paste selective for disassembly of electronic components from printed circuit boards (PCBs). The low temperature disassembly process realised by additive manufacturing (AM) enables the subsequent reuse of electronic components in future applications. The presentation describes the development of the etching mixture/desoldering paste, the influence of its composition on its etching properties, and the development of procedures and tools for objective evaluation of the etching properties of the desoldering paste. Various methods of desoldering paste printing processes will be tested, including the use of a collaborative robot that can be easily integrated into a fully automated process in the future. An important part is also the possibility of recycling materials during the desoldering process, or rather the recovery of selected elements of the soldering pastes for their subsequent use.	desoldering paste, additive manufacturing, selective disassembly, electronic components, printed circuit boards, recycling